Importance

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Abstract

An adapter, having a dielectric substrate upon which are mounted an array of uniformly-spaced, coplanar conductive strips and impedance standards having similarly spaced coplanar leads, facilitates planar transmission line probe measurements of the high-speed electrical characteristics of a package or other interconnect structure for a high-speed integrated circuit. The conductive strips of the adapter are connected to the terminals of the package so as to simulate the integrated circuit connection, that is, with substantially identical length and spacing of bond wires. The planar probe, by contacting the conductive strips of the adapter, is able to measure the electrical characteristics of the package including the bond wires, thereby providing realistic measurements of the integrated circuit's environment. The impedance standards on the adapter are specially designed to enable the effects of the adapter to be removed from the measurements by calibration.

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First Claim