Molded integrated circuit package incorporating decoupling capacitor
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United States of America Patent
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-
Feb 19, 1991
Grant Date -
N/A
app pub date -
Feb 12, 1990
filing date -
Feb 12, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A decoupling capacitor is attached directly to an IC lead frame and thereafter encapsulated within a molded package along with an IC chip resulting in a decoupling scheme which is internal to the molded IC package. The capacitor preferably comprises a thin layer of ceramic dielectric sandwiched between top and bottom conductors. The top conductor may be attached to the die bar of the lead frame using an electrically non-conductive or conductive adhesive. Leads extending from the capacitors are attached to appropriate fingers of the lead frame by welding, soldering or the like to effect strong mechanical and electrical contact.
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