Bonding electrical leads to pads on electrical components
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United States of America Patent
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-
Feb 26, 1991
Grant Date -
N/A
app pub date -
Apr 24, 1990
filing date -
Apr 24, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Bonding a plurality of TAB tape leads to electrical pads in and aligned with the surface of a die by covering the pads with a plurality of electrically conductive particles, aligning the electrical leads with the particles and the pads, and simultaneously bonding the particles to the pads and the electrical leads to the particles. Preferably the particles are solid spheres and may be applied in various ways such as covering the entire surface with the spheres, covering the pads with an adhesive material prior to the spheres, or covering the pads with a mixture of adhesive and spheres. The method is particularly well suited for flip chip bonding.
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