Method of manufacture interconnect device
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United States of America Patent
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-
Feb 26, 1991
Grant Date -
N/A
app pub date -
May 15, 1989
filing date -
May 15, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An interconnect device for electronic components, such as integrated circuits, multichip modules and the like, and the method of manufacture thereof are presented. The interconnect device has two layers of circuitry, one for signal transmission and one for voltage plane. The interconnect device is made by a processing on a stainless steel carrier plate to achieve high lead count capability with fine line widths and spacing, as well as precise registration layer to layer. Laser drilling is used to define interconnect vias between signal and voltage (power or ground) plane layers.
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