Importance

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Abstract

A direct (metal-metal compound eutectic) bond process is improved by disposing a eutectic/substrate-wetting enhancement layer on the substrate prior to performing the direct bond process to bond a metal foil to the substrate. Where the metal is copper, the direct bond process is rendered more effective than prior art direct bond processes on alumina and beryllia and makes the direct bond process effective on tungsten, molybdenum and aluminum nitride, all of which were unusable with the prior art direct bond copper process. A variety of new, useful structures may be produced using this process. The eutectic/substrate-wetting enhancement layer is preferably a noble-like metal or includes a noble-like metal such as platinum, palladium and gold.

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First Claim