Stack type semiconductor package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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Feb 26, 1991
Grant Date -
N/A
app pub date -
Feb 9, 1990
filing date -
Feb 15, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In a semiconductor device, an outer lead is divided into plural leads at an outer lead region connected to an inner lead which is connected to an electrode terminal of a semiconductor chip, a plurality of TAB packages on which the semiconductor chip has been packaged are stacked in plural layers, at least one of the plural divided leads every stacked layers is left and a predetermined number of the divided leads are cut out, and these stacked TAB packages are mounted on a circuit board.
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