Device for interconnection and protection of a bare microwave component chip
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United States of America Patent
Stats
-
Feb 26, 1991
Grant Date -
N/A
app pub date -
Mar 21, 1989
filing date -
Mar 25, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
In order to interconnect an unprotected bare chip of MMIC (microwave monolithic integrated circuit), a ceramic substrate carries a double-face circuit. A network of microstrip lines which radiate from the center to the periphery is disposed on the first face of said double-face circuit. The bare MMIC chip and its microwave environment is fixed on the second face which is metallized as a ground plane. The microwave circuit is interconnected with the network of microstrips by means of plugged metallized holes. A sole-piece provided with a housing for the MMIC is fixed on the ground plane. The first face can carry self-protected components.
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