High temperature resistant fast soldering wire enamel
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United States of America Patent
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Mar 5, 1991
Issued Date -
N/A
app pub date -
Sep 6, 1989
filing date -
Sep 8, 1986
priority date (Note) -
Expired
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Abstract
A solderable polyurethane wire enamel composition comprising a mixture of a blocked isocyanate and polyesterimide resin wherein the ratio of isocyanate groups in the blocked isocyanate to hydroxyl groups in the polyesterimide resin is about 0.82:1 to about 5.7:1 and the hydroxyl to carboxylic acid ratio of the raw materials used in preparing the polyesterimide is about 1.4:1 to about 2.5:1.
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