Method and apparatus for adjusting plating solution flow characteristics at substrate cathode periphery to minimize edge effect
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United States of America Patent
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Mar 19, 1991
Grant Date -
N/A
app pub date -
Jan 2, 1990
filing date -
Jan 2, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method and apparatus for electroplating metallized bumps of substantially uniform height on predetermined terminal areas of a substrate. Cup plating apparatus includes elements for adjusting parameters affecting the geometry of the substrate relative to the plating cup, as well as flow rate of the electroplating solution against the substrate surface. By achieving non-laminar flow of the electroplating solution near the substrate edges, the plating characteristics of the electroplating solution are altered in this region, substantialy offsetting 'edge effect', so that the resulting plated bump height is substantially uniform across the substrate.
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