Curable polyphenylene ether-polyepoxide compositions from melt processed polyphenylene ethers, and laminates prepared therefrom
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 19, 1991
Grant Date -
N/A
app pub date -
Oct 11, 1988
filing date -
Oct 11, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Compositions comprising a polyepoxy compound (preferably bisphenol A diglycidyl ether) and a polyphenylene ether which has been melt processed (e.g., by extrusion) at a temperature in the range of about 230.degree.-390.degree. C., are cured at temperatures in the range of about 190.degree.-250.degree. C. by various epoxy cure catalysts. They may be used in the preparation of laminates with excellent dielectric properties, solvent resistance and solder resistance, useful in printed circuit board production.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully