Dry interface thermal chuck temperature control system for semiconductor wafer testing
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Mar 19, 1991
Grant Date -
N/A
app pub date -
Jan 24, 1990
filing date -
Jan 24, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A wafer chuck temperature control system is disclosed for use in a semiconductor wafer testing apparatus. The wafer chuck is divided into a plurality of temperature sensor and cooling element domains corresponding to chip location regions of an overlying undiced wafer being tested. Computer scanning of the sensors determines which domain is the one harboring the heat source (chip under test) and selects the same for connection to a closed loop temperature control feedback servo. Provision also is made for introducing a helium gas interface between the wafer and the chuck by placing annular grooves in the face of the chuck through which the helium flows when the wafer is vacuum-seated against the chuck. A predetermined helium gas flow rate is maintained to preserve vacuum holddown and to optimize the thermal resistance of the wafer-chuck interface.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully