Composition for circuit connection, method for connection using the same, and connected structure of semiconductor chips
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United States of America Patent
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-
Mar 19, 1991
Grant Date -
N/A
app pub date -
Nov 30, 1989
filing date -
Dec 5, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A composition comprising (A) an epoxy resin type adhesive, (B) particles obtained by coating a nucleus of a curing agent with a film, (C) pressure-deformable electroconductive particles having an average particles size larger than that of the particles (B), and if necessary (D) rigid particles having an average particle size smaller than that of the particles (B), is effective for connecting circuits electrically or connecting a semiconductor chip to a wiring substrate.
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