Wire bonding method with a frame, for connecting an electronic component for testing and mounting
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United States of America Patent
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-
Mar 26, 1991
Issued Date -
N/A
app pub date -
Nov 3, 1989
filing date -
Apr 17, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A device and method are disclosed for connecting an electronic component so that it can be tested and mounted. According to the method, pads on the component are first connected to pads on a surrounding frame, by means of conducting wires. The component is tested by probes of the testing instruments to the pads of the surrounding frame. When the tests are done, the component and its frame is placed on the substrate on which it has to be mounted. The pads of the component are connected to pads on the substrate by the wires used for connection to the pads of the surrounding frame. After connection, the wires are cut between the substrate pads and the frame pads, and then the frame is removed.
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Cited Art Landscape
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