Rigid flex printed circuit configuration
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United States of America Patent
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-
Apr 2, 1991
Grant Date -
N/A
app pub date -
Jan 23, 1990
filing date -
Jan 23, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A process for fabricating a multi-layer flex and rigid-flex board and the board disclosed which substantially reduces the amount of expansion in the direction perpendicular to the plane of the board which occurs between laminated pattern circuit layers in a manner that substantially reduces the tendency of the through-hole plated connections to fail. This is done without sacrificing the attributes of using some flexible material in the rigid zones.
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