Pattern forming method

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United States of America Patent

PATENT NO 5005046
SERIAL NO

07496010

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ATTORNEY / AGENT: (SPONSORED)

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Abstract

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A method for forming patterns includes the steps of forming a first layer presenting at least one first alignment mark on a substrate and forming a second layer presenting at least one first pattern and two alignment marks on top of the first layer. The alignment marks of the second layer are independently aligned relative to the first alignment mark. The positions of the alignment marks of the second layer are measured and the deviations of such marks from preselected design positions are calculated. The substrate is moved to a corrected position determined from the calculated deviations. Finally a third layer which includes at least one second main pattern is formed on the second layer by aligning the second main pattern with the second alignment marks.

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Patent Owner(s)

Patent OwnerAddress
FUJITSU MICROELECTRONICS LIMITED7-1 NISHI-SHINJUKU 2-CHOME SHINJUKU-KU TOKYO 163-0722

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Hashimoto, Koichi Yokohama, JP 149 2010

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