Fabrication of pad array carriers from a universal interconnect structure
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United States of America Patent
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-
Apr 9, 1991
Grant Date -
N/A
app pub date -
Dec 7, 1989
filing date -
Dec 7, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A method of manufacturing a chip carrier from a universal ceramic substrate provides for a universal ceramic substrate having first and second opposed sides and an array of conductively filled through-holes. On the first side, wire bond pads and conductors connected to the conductively filled through-holes are provided as required. Similarly, on the second side, solder pads on the conductively filled through-holes are provided as required. Finally, at least one insulating layer is provided over part of the first side for die attachment.
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