Segmented backplane for multiple microprocessing modules
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United States of America Patent
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Apr 9, 1991
Issued Date -
N/A
app pub date -
Oct 12, 1989
filing date -
Apr 25, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The invention relates to a novel type of segmented backplane for multiple microprocessor module boards. The modules are connected to a plurality of backplane segments. Each backplane segment includes connectors for attachment of the microprocessing modules, and a bus segment. When the backplane segments are connected together, the bus segments form a continuous bus. The microprocessing modules carry out their intra-module communication entirely within their own backplane segment without communication through the bus. However, all inter-module communication is carried out through the bus.
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