Non-destructure method of performing electrical burn-in testing of semiconductor chips
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United States of America Patent
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Apr 16, 1991
Grant Date -
N/A
app pub date -
Apr 18, 1990
filing date -
Apr 18, 1990
priority date (Note) -
Expired
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Abstract
A method of nondestructively testing electronic chips adapted for direct attachment to metallized pads on circuitized substrate is disclosed, wherein an electrically conductive liquid eutectic joint is formed at room temperature with low pressure between electrical terminals on the chip and pads on the substrate. The eutectic joint remains liquid at test temperature, enabling test completion. At the end thereof, chips and pads are separated and any eutectic material residue thereon removed. The eutectic is preferably gallium/indium.
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