Testable ribbon bonding method and wedge bonding tool for microcircuit device fabrication
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United States of America Patent
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-
Apr 16, 1991
Grant Date -
N/A
app pub date -
Dec 26, 1989
filing date -
Dec 26, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electrical circuit component is temporarily fixed to a temporary substrate. Electrical contacts on the component are interconnected with corresponding contacts on the test substrate by lead wires or ribbons using a bonding wedge that forms the lead wires into a gull-wing shape with central portions thereof formed adjacent to edge portions of the component. The component is subjected to a test procedure while fixed to the temporary substrate via signals applied to the contacts thereof. The lead wires are then severed near their connection to the temporary substrate, and the component with the remaining lead wire portions attached is removed from the test substrate. The lead wires are sufficiently stiff and/or are adhered to the edge portions of the component with an adhesive so as retain their shapes after removal of the component from the temporary substrate. The component is then adhered to a permanent device substrate, and the ends of the lead wires are bonded to corresponding contacts on the device substrate.
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