Three-dimensional printed circuit board
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United States of America Patent
Stats
-
Apr 16, 1991
Grant Date -
N/A
app pub date -
Jul 24, 1989
filing date -
Sep 15, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A three dimensional printed circuit board having at least two rigid board sections capable of being arranged in different planes and flexibly connected by connecting sections between adjacent board sections is manufactured as a one-piece injection molded part of a thermoplastic molding material. The flexible connecting sections are fashioned as thin regions having a thickness less than the thickness of the rigid board sections. When a semi-crystalline or liquid-crystalline thermoplastic molding material is used, the connecting sections are formed as flexible film hinges, whereas an amorphous thermoplastic molding material results in the connecting sections being bendable only under the influence of heat.
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