Importance

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Abstract

A tape automated bonding (TAB) test coupon excised from a TAB frame and a process for testing the coupon and the die mounted thereon. The coupon includes a relatively thin film of dielectric material and a pattern of substantially adjacent inner lead pads on the dielectric film. The inner lead pads are disposed in close proximity to the die. A pattern of substantially adjacent test probe pads generally surround the pattern of inner lead pads for providing test points for the frame and the die thereon. A pattern of substantially adjacent outer lead pads generally surround the pattern of test probe pads for providing input/output ports to the die. Electrical conductors interconnect the inner lead pads, the outer lead pads and the test probe pads in a predetermined conductive pattern. The inventive test process includes the steps of excising the die from the frame in the form of a coupon. The coupon contains the die, the inner lead pads and the pattern of test probe points. The coupon is then placed onto a test prober and the die is aligned in preparation for testing.

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First Claim