Soldering apparatus and method of using the same
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United States of America Patent
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-
Apr 23, 1991
Grant Date -
N/A
app pub date -
Feb 15, 1989
filing date -
Feb 15, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A soldering apparatus includes a holding device, which is composed of a ceramic material and fits over and covers partially, a thermod having an electrically grounded conductor portion to distribute heat uniformly to a soldering surface. The soldering apparatus is moved so that the thermod engages the surface to be soldered. Thermal energies are then uniformly transferred by the thermod to heat the connecting joint to soldering temperature and for heating a solder bead for soldering purposes. After soldering, the apparatus is retracted, or the current is turned off, to permit the surface to cool.
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