Apparatus for forming thin film
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United States of America Patent
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-
Apr 30, 1991
Grant Date -
N/A
app pub date -
Jun 7, 1989
filing date -
Oct 25, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Apparatus for forming a thin film on a substrate surface by a CVD (Chemical Vapor Deposition) method which includes diffusing pipes for diffusing and supplying a first reactive gas, and uniformizing plates for supplying uniformly an active species formed through excitation of a second reactive gas. The first reactive gas and the active species are mixed uniformly with each other, and the resultant uniform mixture is supplied uniformly to the substrate surface, whereby a uniform film deposition rate is obtained in a reaction zone in which the thin film is formed, and a uniform thin film is formed over the entire substrate surface even when the area of the substrate surface is large.
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