Enhanced collapse solder interconnection
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Apr 30, 1991
Grant Date -
N/A
app pub date -
Jul 27, 1990
filing date -
Jul 27, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A soldered electrical interconnection is made between a device and a circuit carrying substrate. A device (200) is formed with two solderable surfaces, the second solderable surface (204) adjacent to, but not touching, the first solderable surface (202). A sphere of solder (206) is placed upon a solderable surface (202) of the device and reflowed. The component and solder sphere assembly is placed on a circuit carrying substrate (210) and reflowed, such that the solder sphere reflows and is wetted to both solderable surfaces on the device.
First Claim
Family
International Classification(s)
- [Classification Symbol]
- [Patents Count]
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully