Semiconductor die and mounting assembly
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United States of America Patent
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-
Apr 30, 1991
Grant Date -
N/A
app pub date -
May 18, 1987
filing date -
May 18, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A uniformly thick dielectric polyimide coating is provided on the back face of an integrated circuit and the die is mounted to a copper lead frame finger by interposing an epoxy resin bonding agent between the uniformly thick polyimide coating and the copper support finger. The die coating is provided before separating die from the precursive water. Liquid polyimide is poured onto the back side of the water which is spun, in a manner similar to that usually used for obtaining uniformly thick photoresist films. After curing the polyimide, the die are cut from the wafer by sawing.
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