Identification card with integrated circuit
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United States of America Patent
Stats
-
May 7, 1991
Issued Date -
N/A
app pub date -
Jan 23, 1989
filing date -
Dec 28, 1982
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A multilayer identification card containing an IC module in a cavity. The cavity is filled with a polymer with a consistency ranging from liquid to pasty before the card compound is laminated using pressure and heat. During lamination, the polymer completely fills in the cavity around the IC module, supported by the applied pressure. In the finished card, the polymer is cross-linked to form a solid, rubber-like mass, which protects the IC module in the cavity of the card.
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Family
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