Coplanar waveguide semiconductor package
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
May 7, 1991
Issued Date -
N/A
app pub date -
Mar 23, 1990
filing date -
Nov 16, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A package for a semiconductor device includes a base having a flat surface with an edge of a predetermined shape for abutting against a similar edge of another object. Conductors are placed on the flat surface of the base and extend to but do not overlap the edge of predetermined shape. The base along with a frame and a cover cooperate to provide a package which encloses and protects the semiconductor device. The package can be placed adjacent a similarly shaped package so that the overall structure takes up a minimal amount of space. Ground planes located on the base can be readily interconnected.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully