Semiconductor device
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United States of America Patent
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May 14, 1991
Issued Date -
N/A
app pub date -
Apr 2, 1990
filing date -
Dec 8, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor device is provided with an electrically conductive cap having a sufficiently thick edge portion for preventing warpage due to the hardening of an encapsulating resin. Since the edge portion of the conductive cap is formed into the shape of a frame, and its thickness is made large, the mechanical strength of the conductive cap is improved, so that even when stress is applied to the conductive cap owing to the hardening of the encapsulating resin, the conductive cap is unlikely to undergo deformation, thereby preventing the warping of the semiconductor device.
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