Three dimensional integrated circuit package
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United States of America Patent
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-
May 14, 1991
Issued Date -
N/A
app pub date -
Sep 18, 1989
filing date -
Oct 27, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
This invention discloses a three-dimensional, high density package for integrated circuits for which integrated circuits are placed onto substrate layers and then stacked together. Techniques for interconnecting the layers to one another and for connecting the layers to external circuitry are also disclosed. Techniques for cooling the stack with heat sinks or fluid flow are also disclosed.
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