High density chip stack having a zigzag-shaped face which accommodates connections between chips
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United States of America Patent
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May 28, 1991
Grant Date -
N/A
app pub date -
Feb 14, 1990
filing date -
Feb 14, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A high density integrated circuit module is comprised of a plurality of integrated circuit chips; each of the chips has top and bottom surfaces and thin sides; and all of the chips are arranged in a stack in which the sides of the chips form multiple faces of the stack. Also, in accordance with the invention, a selected face of the stack has a zigzag shape which exposes a portion of the top surface of each chip on that face; and, bonding pads for carrying input/output signals to/from the chips are located on the exposed top surface portion of the chips. This zigzag shape is produced by (a) providing an indentation in the side of each of the chips which lie along the selected stack face; or (b) by offsetting the sides of the chps from each other as they lie along the selected stack face; or (c) by providing respective spacers between the chips and indenting them from the chips along the selected stack face.
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