Surgical treatment method and instrument

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United States of America Patent

PATENT NO 5020995
SERIAL NO

07299472

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Abstract

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A method and apparatus for cutting tooth tissue by generating laser radiation at a wavelength which is absorbed more strongly by hydroxyapatite than by water; producing a succession of pulses of the generated radiation with an energy level, pulse duration, and repetition rate selected to cut the tooth tissue without causing harmful side effects; and concentrating the radiation pulses on the tissue to a spot sufficiently small to cause cutting of the tissue.

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Patent Owner(s)

Patent OwnerAddress
ENDO TECHNIC INTERNATIONAL CORPORATION3002 DOW AVENUE SUITE 114 TUSTIN CA 92680

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Levy, Guy 49, rue Croix de Regnier, F-13004 Marseille, FR 30 860

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