Laser soldering method and apparatus
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United States of America Patent
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-
Jun 4, 1991
Grant Date -
N/A
app pub date -
May 2, 1990
filing date -
May 2, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An electronic device (10) is surface mounted to bonding pads (11) of a substrate (12) by first mounting the device within an aperture (24) of a glass plate (17). The leads (14) of the electronic device are coated with solder and pressed onto the bonding pads by the reusable glass plate (17). While pressing the plate against the leads, the plate is scanned with a laser beam (16) directly over each row of bonding pads. The laser light is of an appropriate wavelength such that the glass plate converts the laser light to heat, which melts the solder to bond the leads to the bonding pads.
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