Method of manufacturing circuit board for mounting electronic components
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United States of America Patent
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Jun 11, 1991
Grant Date -
N/A
app pub date -
Jan 2, 1990
filing date -
May 1, 1989
priority date (Note) -
Expired
status (Latency Note)
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Abstract
According to the present invention, a circuit board for mounting electronic components including a metal layer united with a substrate layer with a predetermined portion of the metal layer exposed is manufactured by disposing a mask between a substrate layer and a metal layer where the metal layer is to be exposed and uniting the substrate layer and the metal layer with the mask therebetween, projecting a laser beam onto the substrate layer at the periphery of the mask to cut away the substrate layer adjacent to the mask, and stripping off that part of the substrate layer which remains on the mask and the mask.
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