Palladium alloy electroplating process
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United States of America Patent
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Jun 18, 1991
Issued Date -
N/A
app pub date -
May 11, 1990
filing date -
Aug 29, 1989
priority date (Note) -
Expired
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Abstract
An electroplating process is described for electroplating alloys of palladium and arsenic. The resulting electrodeposits are bright, ductile and remain ductile and crack-free even when the electrodeposits are quite thick. The deposits are quite hard and suitable for contact surfaces particularly in situations where wear characteristics require thick deposits. The electroplating process is also useful for making articles such as bellows by electroform procedures particularly since the electroplated material has extraordinary physical properties (good resilience, low stress and ductility) as well as good corrosion resistance.
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