Modified polybutylene-base hot melt compositions
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United States of America Patent
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Jun 18, 1991
Issued Date -
N/A
app pub date -
Jul 30, 1990
filing date -
Aug 31, 1987
priority date (Note) -
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Abstract
A hot melt adhesive and a laminar structure fabricated from a blend comprising a modified or unmodified ethylenic copolymer, a modified or unmodified butene-1 homopolymer or copolymer, a stabilizer and one or more of: a tackifying resin compatible with the major amount of modified polymer, a wax, and atactic polypropylene.
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