Automated method for the manufacture of small implantable transponder devices
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 25, 1991
Grant Date -
N/A
app pub date -
May 25, 1990
filing date -
May 25, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved automated method for the manufacture of small implantable passive transponder devices is presented in which semiconductor wafer die are bonded to a conductively coated tape leadframe. This tape, with die attached, is injected molded to form a cap around the leads and the attached die, such that the exposed portion of the leads extend laterally from the cap. A ferrite core is attached to the base of the cap, and a fine coil wire, dispensed from a specially designed applicator, is automatically bonded to one of the leads protruding from the cap body. The wire is subsequently wound around the ferrite core and terminated by automatic attachment to another of the protruding leads. The assembled device is thereafter encapsulated within a small glass housing.
First Claim
Family
International Classification(s)
Cited Art Landscape
Patent Citation Ranking
Advertisement
Advertisement
Advertisement
Recipient Email Address
Recipient Email Address
Comment
Recipient Email Address
Add to Portfolio(s)
To add this patent to one, or more, of your portfolios, simply click the add button.
This Patent is in these Portfolios:
Add to additional portfolios:
Last Refreshed On:
Changes done successfully