Slotless type IC carrier
Number of patents in Portfolio can not be more than 2000
United States of America Patent
Stats
-
Jun 25, 1991
Issued Date -
N/A
app pub date -
May 18, 1990
filing date -
Mar 10, 1988
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An IC carrier includes an IC accommodating section formed in a central portion of a generally rectangular thin substrate, a lock for holding an IC package body in the IC accommodating section, and a lead wire supporting seat disposed on a substrate portion extending at the periphery of the IC accommodating section and adapted to support lead wire groups projecting sideward from the IC package body. The lead wire supporting seat is defined by a slotless flat surface for accommodating a group of the lead wires over its entire width. The lead wire groups are supported as a package on the lead wire supporting surfaces.
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