Printed circuit boards and cards having buried thin film capacitors and processing techniques for fabricating said boards and cards
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Jun 25, 1991
Grant Date -
N/A
app pub date -
Apr 9, 1990
filing date -
Apr 9, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Disclosed is a multilayer circuit package having a buried thin film capacitor. The circuit package includes at least a power core, a ground core, a first signal core, a second signal core, and the integral, buried, thin film capacitor. The integral, buried, thin film capacitor serves to capacitively couple the first and second signal cores. Structurally, the first signal core includes at least one first wire that terminates in at least one first electrode, while the second signal core includes at least one second wire that terminates in at least one second electrode. At least a portion of the first electrode overlays at least a portion of the first electrode overlays at least a portion of the second electrode and is separated therefrom by a thin film of a dielectric material. The first electrode, the second electrode, and the thin film of dielectric material define the integral buried capacitor. The thin film capacitor is prepared by thin film methodology, with epitaxial deposition of the dielectric.
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