Pre-wired injection molding assembly
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United States of America Patent
Stats
-
Jul 9, 1991
Grant Date -
N/A
app pub date -
Sep 4, 1990
filing date -
Sep 4, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A pre-wired injection molding assembly to be supplied to the customer for installation in a mold. The assembly includes a number of sub-manifolds connected to a main manifold, a wiring frame having a number of elongated fingers connected to the sub-manifolds, and a number of heated nozzles connected to the sub-manifolds. The fingers of the wiring frame extend from a hollow channel member which leads to a connector box. The assembly is pre-wired by the supplier by running the wires from the nozzles along the fingers and through the channel member to the connector box. The pre-wired assembly is mounted from the rear in a matching mold manifold plate which greatly facilitates installation and disassembly for the customer.
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