Process for manufactoring hermetic high temperature filter packages and the products produced thereby
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United States of America Patent
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-
Jul 16, 1991
Grant Date -
N/A
app pub date -
May 9, 1989
filing date -
May 9, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
This invention relates to a hermetically sealed electronic component package and method for making the package. In one embodiment of the invention, the electronic component is mechanically and electrically attached to the package by heating rings of brazing material. In another embodiment of the invention, an insulative, inorganic preform is heated to mechanically attach the electronic circuit within the package housing. The package is then hermetically sealed by mounting a preform within an electronic component package and heating the combination to a second predetermined high temperature to cause the preform to flow.
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Cited Art Landscape
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