Processes in which matter is subjected to fluid flow
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United States of America Patent
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Jul 23, 1991
Grant Date -
N/A
app pub date -
Apr 23, 1990
filing date -
Oct 23, 1987
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
Apparatus is provided for subjecting matter to fluid flow. The apparatus comprises a chamber (10) having an annular fluid inlet (14) beneath a first annular region (22) in the chamber. A second annular region (24) is contiguous with and disposed outwardly of the region (22) between the region (22) and a circumferential wall (12), which has a slope (18) towards the annular inlet (14). Means shown as an annular array of radially extending slots provided in an annular wall portion (FIG. 3) direct fluid through the inlet (14) with vertical and circumferential flow components. In use matter in the chamber is moved in a band continuously along an annular path in the regions. (22, 24). The matter is moved vertically and circumferentially while in the region (22) by the flow therein, is moved out of this flow into region (24) by circumferential force and is directed back into the region (22) by the slope (18) as indicated by arrows (30). Thus the matter is not continuously subjected to the fluid flow while being moved in its annular path in the chamber (10).
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