Temperature conditioning support for small objects such as semi-conductor components and thermal regulation process using said support
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United States of America Patent
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Jul 23, 1991
Grant Date -
N/A
app pub date -
Apr 28, 1989
filing date -
May 5, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The invention concerns a temperature conditioning support for thermal tests on small objects such as semiconductor wafers incorporating integrated circuits. It consists of a platen and a hollow base. Inside the hollow cavity is contained a serpentine which can convey thermal fluid capable of heating and/or cooling the platen to achieve temperature regulation of the object placed on the platen, according to data supplied by a thermometric system that includes a temperature sensor associated to said support. The platen is made of electrically insulating and thermally conducting ceramic, the base being made of a material whose thermal expansion coefficient is substantially equal to that of the platen. A thin-film electrical resistance can be provided to ensure heating and, optionally, temperature measurement of the platen.
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