Importance

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Abstract

An integrated circuit element is provided, which may be an active or passive element, comprising a planar dielectric layer having a thickness 25 micrometers or less and a dielectric constant less than 3.4. The dielectric layer is preferably a fluoropolymer film coated or impregnated with a low ionic content resin. The preferred fluoropolymer is expanded polytetrafluoroethylene and the preferred resin component is a low ionic content polymer having a low dielectric constant, high thermal stability, and low thermal expansion, formed by addition polymerization. 'Planarity' is defined as the ratio of the height of the dielectric at a point where there is no feature beneath the layer divided by the height of the dielectric over a feature, including the thickness of the feature. All products according to the invention have planarity exceeding 0.8.

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First Claim