Method and apparatus for wire bonding
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United States of America Patent
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Aug 6, 1991
Grant Date -
N/A
app pub date -
Nov 28, 1989
filing date -
Nov 28, 1988
priority date (Note) -
Expired
status (Latency Note)
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Abstract
The present invention relates to a ball bonding technique using an insulated wire in assembling a semiconductor chip in which the ball is formed at the end of an insulated wire by an electrical discharge and the insulation at a portion of the wire to be bonded a predetermined distance from one end of the wire is removed by an electrical discharge.
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