Method for manufacturing oxygen-free copper

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United States of America Patent

PATENT NO 5037471
SERIAL NO

07439936

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Abstract

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Method and apparatus for manufacturing an oxygen-free copper having an oxygen content of no greater than 3 ppm by weight are disclosed. In the method, a deoxidizing step is carried out by bringing a reducing gas containing hydrogen gas into contact with a molten copper to react to the oxygen to remove the same. Then a dehydrogenation step may be carried out by bringing a gas of lean hydrogen concentration into contact with the molten copper. Accordingly, the apparatus has a deoxidizing device for blowing the reducing gas into the molten copper and preferably a dehydrogenation device.

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Patent Owner(s)

Patent OwnerAddress
MITSUBISHI MATERIALS CORPORATION2-3 MARUNOUCHI 3-CHOME CHIYODA-KU TOKYO 1008117 ?1008117

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Inventor(s)

Inventor Name Address # of filed Patents Total Citations
Asao, Haruhiko Tokyo, JP 14 100
Hagiwara, Hideru Tokyo, JP 2 21
Iwamura, Takuro Saitama, JP 9 109
Koya, Tsugio Saitama, JP 3 46
Sato, Hideki Osaka, JP 301 3919
Shigematsu, Toshiaki Tokyo, JP 2 21
Sukekawa, Izumi Tokyo, JP 4 25

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