Die attach using gold ribbon with gold/silicon eutectic alloy cladding
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United States of America Patent
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-
Aug 6, 1991
Grant Date -
N/A
app pub date -
May 12, 1989
filing date -
May 12, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
An improved method for eutectically bonding a silicon wafer into a cavity of a packaging body. A gold/silicon eutectic alloy cladding is formed on a ribbon made of gold. A strip is cut from the ribbon and placed into the package cavity with the cladding side up. Then a die is placed onto the strip on top of the gold/silicon cladding. The die is then scrubbed at a temperature of approximately 400.degree. C. and the gold/silicon cladding acts as a catalyst to form a gold/silicon eutectic bond between the die and the packaging body.
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