Compact silicon module for high density integrated circuits
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United States of America Patent
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Aug 13, 1991
Issued Date -
N/A
app pub date -
Sep 6, 1989
filing date -
Dec 28, 1987
priority date (Note) -
Expired
status (Latency Note)
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Abstract
A semiconductor module that densely packs integrated circuit chips to provide electronic systems or large memory modules in an array of stacked silicon boards. The semiconductor chips may be flip mounted and the back side of each chip is in thermal contact with an adjacent silicon board to provide heat conduction away from the chip.
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