High force clip
Number of patents in Portfolio can not be more than 2000
United States of America Patent
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-
Aug 13, 1991
Grant Date -
N/A
app pub date -
Jun 7, 1990
filing date -
Jun 7, 1990
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A clip for attaching a semiconductor to a heat sink comprises an arcuate section having a lip which contacts a projection on a heat sink so that the remainder of the arcuate section is disposed over the projection, the arcuate section also having a central stiffening rib. The clip further comprises a plate extending from the end of the arcuate section opposite its lip, the plate having sidewalls which form a semiconductor opening. When the clip is in place on the heat sink, the clip is flexed, and the plate is forced against a semiconductor, holding it in place against the heat sink.
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