Method of encapsulating an integrated circuit using a punched metal grid attached to a perforated dielectric strip
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United States of America Patent
Stats
-
Aug 20, 1991
Grant Date -
N/A
app pub date -
Apr 5, 1990
filing date -
Apr 7, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
The disclosure concerns the encapsulation of integrated circuit chips, notably with a view to their being incorporated in a chip card. The encapsulation method comprises the formation of a pre-punched metallic conductive grid, the formation of a strip of pre-perforated plastic material, the transfer of a strip to the grid, the positioning of an integrated circuit chip in a perforation of the strip, and the formation of electrical connections between the chip and zones of the grid located in perforations of the strip. The perforations of the strip and the punched slots of the grid are arranged so that the strip covers and blocks all the interstices between conductors of the grid in the useful region corresponding to a module to be made. When a protecting resin is laid, it is confined and does not leak through the interstices of the grid. A plastic or metal ring defines the heightwise dimension of the micromodule.
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