Lead frame and semiconductor device using the same
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United States of America Patent
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-
Aug 20, 1991
Grant Date -
N/A
app pub date -
May 2, 1990
filing date -
May 10, 1989
priority date (Note) -
Expired
status (Latency Note)
Importance
Abstract
A lead frame having a plurality of inner leads and outer leads, said outer leads being subjected to surface treatment for improving solder wettability at an end portion and to sruface treatment for suppressing solder wettability at least at a portion neighboring to the end portion, or said outer leads being bent 4 times or more, is effective for improving thermal fatigue life and reliability when applied to a semi-conductor device.
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